Mechanical Properties and Adhesion (E2-2-)
Monday, Apr 23 2018 1:30PM, Room Royal Palm 4-6
Moderated by: Gerhard Dehm, MPI für Eisenforschung GmbH; Megan Cordill, Erich Schmid Institute of Materials Science; Ming-Tzer Lin, National Chung Hsing University
Abstracts (Use Expand/Collapse icon in first column to see/hide details)
Logon for Personal Schedule SchedulePaper #Invited TalkTitle
1:30 PME2-2-1Controlling the Chemomechanical Effects in Sapphire by Ion-implantation
1:50 PME2-2-2Magnetron Sputtering of Refractory Metal Thin Films on NiTi Shape Memory Alloy Sheets
2:10 PME2-2-3Quantitative In Situ SEM MEMS High Cycle Fatigue: the Critical Role of Oxygen on the Nanoscale-Void-Driven Nucleation and Propagation of Small Cracks in Ni Microbeams
2:50 PME2-2-5Role of Microstructure on the Interface Stability of Copper Thin Films on Brittle Substrates
3:10 PME2-2-6Mechanical Reliability of Barrier Films for Flexible Electronics
3:30 PME2-2-7Molecularly Grafted, Structurally Integrated Multifunctional Polymer Thin Films with Improved Adhesion
3:50 PME2-2-8Thin-film Adhesion Characterization by Colored Picosecond Acoustics
4:10 PME2-2-9Imaging Thin Film Adhesion with Picosecond Ultrasonics
4:30 PME2-2-10Mechanical Property Evaluation of Zr-Ti- Fe Thin Film Metallic Glasses
4:50 PME2-2-11Mechanical Properties Measurement of Submicron Ti-Ni Shape Memory Alloys Thin Films
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